Title:
CURABLE RESIN COMPOSITION AND CURED PRODUCT
Document Type and Number:
Japanese Patent JP2023180708
Kind Code:
A
Abstract:
To provide a novel radical polymerization initiator for a curable resin composition while preventing the deterioration of the dielectric loss tangent of a cured product.SOLUTION: A curable resin composition includes a compound A that includes a dioxane skeleton and a methacryloyl group in at least one end of the molecular chain, and a radical curable resin. The content of the compound A is 0.01-20 mass% relative to the total amount of the curable resin composition. The content of the radical curable resin is 10-99.99 mass% relative to the total amount of the curable resin composition.SELECTED DRAWING: None
Inventors:
TAKANO (FURUTA) AIKO
OKADA KANA
YONEHAMA SHINICHI
OKADA KANA
YONEHAMA SHINICHI
Application Number:
JP2022094236A
Publication Date:
December 21, 2023
Filing Date:
June 10, 2022
Export Citation:
Assignee:
MITSUBISHI GAS CHEMICAL CO
International Classes:
C08L101/00; C08F4/00; C08F20/28; C08F283/01; C08K5/101
Attorney, Agent or Firm:
Yoshiyuki Inaba
Toshifumi Onuki
Kazuhiko Naito
Toshifumi Onuki
Kazuhiko Naito
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