Title:
硬化性樹脂組成物、硬化物、接着剤、接着フィルム、カバーレイフィルム、及び、プリント配線板
Document Type and Number:
Japanese Patent JP7211715
Kind Code:
B2
Abstract:
To provide a curable resin composition that has excellent flow characteristics before curing, and has excellent adhesiveness, heat resistance, and flex resistance after curing; and provide a cured product of the curable resin composition, and an adhesive, adhesive film, coverlay film, and printed wiring board comprising the curable resin composition.SOLUTION: A curable resin composition contains thermosetting resin, thermoplastic resin and imide oligomer, with the imide oligomer having a reactive functional group that can react with the thermosetting resin.SELECTED DRAWING: None
Inventors:
Sayaka Wakioka
Kohei Takeda
Takashi Shinshiro
Yuta Otowa
Kohei Takeda
Takashi Shinshiro
Yuta Otowa
Application Number:
JP2018087193A
Publication Date:
January 24, 2023
Filing Date:
April 27, 2018
Export Citation:
Assignee:
Sekisui Chemical Co.,Ltd.
International Classes:
C08L101/00; C08G59/40; C08L63/00; C08L71/10; C08L79/08; C09J7/22; C09J7/35; C09J163/00; C09J171/10; C09J179/08; C09J201/00; H05K3/28
Domestic Patent References:
| JP5306386A | ||||
| JP5125345A | ||||
| JP2004502859A | ||||
| JP2014101491A | ||||
| JP2010100803A | ||||
| JP2007091799A | ||||
| JP2010132793A |
Attorney, Agent or Firm:
Patent Attorney Firm WisePlus
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