Title:
CURABLE RESIN COMPOSITION, DRY FILM, CURED PRODUCT AND ELECTRONIC COMPONENT
Document Type and Number:
Japanese Patent JP2019196444
Kind Code:
A
Abstract:
To provide a curable resin composition that makes it possible to obtain a cured film that has high development resistance even if it is a thin film and shows excellent resolution, and a dry film, a cured film, and a printed wiring board including the same, and a method of producing the same.SOLUTION: One embodiment of a curable resin composition contains (A) an alkali-soluble resin, (B) a compound having an ethylenically unsaturated group, and (C) a photopolymerization initiator, wherein, by light irradiation, an exposed portion is cured, and an unexposed portion can be developed; and a difference between a softening point of the exposed portion and a softening point of the unexposed portion is 15°C or more. Another embodiment of the curable resin composition contains (A) an alkali-soluble resin, (D) a heat curing component, and (E) a photo-base generator, wherein, by light irradiation, an exposed portion is cured, and an unexposed portion can be developed; and a difference between a softening point of the exposed portion and a softening point of the unexposed portion is 15°C or more.SELECTED DRAWING: None
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Inventors:
SHIBAZAKI YOKO
FUNAKOSHI CHIHIRO
SHIBATA DAISUKE
FUNAKOSHI CHIHIRO
SHIBATA DAISUKE
Application Number:
JP2018090922A
Publication Date:
November 14, 2019
Filing Date:
May 09, 2018
Export Citation:
Assignee:
TAIYO INK MFG CO LTD
International Classes:
C08F290/06; C08G59/68; G03F7/004; G03F7/027; H05K3/28
Domestic Patent References:
| JP2012255925A | 2012-12-27 | |||
| JP2003183401A | 2003-07-03 | |||
| JP2007017644A | 2007-01-25 |
Foreign References:
| WO2013022068A1 | 2013-02-14 | |||
| US9188871B2 | 2015-11-17 |
Attorney, Agent or Firm:
Ichiro Honda
Yumiko Sugimoto
Watari Takumi
Takashi Otaguro
Takashi Fujimura
Yumiko Sugimoto
Watari Takumi
Takashi Otaguro
Takashi Fujimura