Title:
CURABLE RESIN COMPOSITION, DRY FILM, CURED PRODUCT AND PRINTED WIRING BOARD
Document Type and Number:
Japanese Patent JP2020200449
Kind Code:
A
Abstract:
To provide a curable resin composition that gives a small variation in the film thickness of coating films prior to drying or coating films after drying even in a thin film state, and avoids visibility of an underlay metal wire.SOLUTION: The curable resin composition of the present invention comprises a curable resin and an extender. A cured film of the curable resin composition having a film thickness of 12 μm after cured shows a glossiness of 0.5 or more and 40.0 or less at angle of 60°. When 0.3 g of the curable resin composition is mixed with 30 g of propylene glycol monomethylether acetate and measured by use of Microtrac, an average particle diameter D50 is 0.1 μm or more and 1.0 μm or less and a specific surface area CS is 10.0 m2/ml or more.SELECTED DRAWING: Figure 1
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Inventors:
ARAI YASUAKI
SHIRAKAWA KENICHI
YANAGIDA NOBUYUKI
SHIRAKAWA KENICHI
YANAGIDA NOBUYUKI
Application Number:
JP2020092509A
Publication Date:
December 17, 2020
Filing Date:
May 27, 2020
Export Citation:
Assignee:
TAIYO INK MFG CO LTD
International Classes:
C08L101/00; C08G59/17; C08G59/40; C08K3/013; C08K3/30; C08K3/36; C08L101/08; G03F7/004; G03F7/027; G03F7/038; H05K3/28
Attorney, Agent or Firm:
Yukitaka Nakamura
Satoru Asakura
Mari Asano
Kazuma Kojima
Satoru Asakura
Mari Asano
Kazuma Kojima