Title:
CURABLE RESIN COMPOSITION AND ITS PRODUCTION METHOD
Document Type and Number:
Japanese Patent JP3943420
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a curable resin composition which is excellent in peel adhesion/adhesion to various adherends and in elongation after curing and has a low viscosity before curing; and its production method.
SOLUTION: This resin composition contains (A) 100 pts.mass silylated urethane resin of which the main chain is a polyoxyalkylene polymer and which has reactive silicon groups at the molecular ends and substituted urea bonds in the molecule, (B) 5-500 pts.mass vinyl polymer prepared by polymerizing a polymerizable vinyl monomer, and (C) 5-500 pts.mass modified silicone resin. The production method is also provided.
More Like This:
Inventors:
Shigeki Mori
Akihiro Sato
Shinichi Sato
Akihiro Sato
Shinichi Sato
Application Number:
JP2002069425A
Publication Date:
July 11, 2007
Filing Date:
March 14, 2002
Export Citation:
Assignee:
Konishi Co., Ltd.
International Classes:
C08L75/06; C08F2/44; C08F220/12; C08F283/00; C08G18/83; C08L33/06; C08L43/04; C08L71/02; (IPC1-7): C08L75/06; C08F2/44; C08F220/12; C08F283/00; C08G18/83; C08L33/06; C08L43/04; C08L71/02; //(C08F220/12; C08F230:08)
Domestic Patent References:
| JP2003238795A |
Attorney, Agent or Firm:
Yoshio Narui
Hideo Takei
Hideo Takei