Title:
CURABLE RESIN COMPOSITION, LAMINATED STRUCTURE, CURED MATERIAL AND ELECTRONIC COMPONENT
Document Type and Number:
Japanese Patent JP2022159172
Kind Code:
A
Abstract:
To provide a curable resin composition having characteristics that a dried coating film obtained has good resolution and that, even when cured materials after thermal curing are stored stacked under a high temperature environment, little sticking occurs.SOLUTION: Provided is a curable resin composition which is alkali-developable and forms a cured film by light exposure and a heating treatment. When a dried film having a thickness of 2-100 μm is formed from this curable resin composition, an arithmetic average roughness Ra of the dried film is less than 0.1 μm, and an arithmetic average roughness Ra of a dried film after thermal curing of the dried film becomes 0.1 μm to 1 μm. The curable resin composition of the present invention has characteristics that a dried coating film obtained has good resolution and that, even when cured materials after thermal curing are stored stacked under a high temperature environment, little sticking occurs.SELECTED DRAWING: None
Inventors:
ODAGIRI YUTO
YOKOYAMA YUTAKA
KOIKE NAOYUKI
YONEDA KAZUYOSHI
MIYABE HIDEKAZU
YOKOYAMA YUTAKA
KOIKE NAOYUKI
YONEDA KAZUYOSHI
MIYABE HIDEKAZU
Application Number:
JP2022057079A
Publication Date:
October 17, 2022
Filing Date:
March 30, 2022
Export Citation:
Assignee:
TAIYO INK MFG CO LTD
International Classes:
G03F7/037; C08G73/14; G03F7/004; H05K3/28
Attorney, Agent or Firm:
Sato Eto
Osamu Yamaguchi
Akiko Kurawaki
Kenji Inagaki
Osamu Yamaguchi
Akiko Kurawaki
Kenji Inagaki