PURPOSE: To form a heat-resistant relief pattern by incorporating a photopolymerization initiator and/or a heat polymerization initiator each in a specified ratio to a specified copolymer.
CONSTITUTION: The curable resin composition contains 0.5-10 pts.wt. of the polymerization initiator and/or the heat polymerization initiator in 100 pts.wt. of the copolymer having a repeating unit represented by formula I in which R, is a 6-15 C organic residue having an aromatic ring; R2 is H, phenyl, or alkoxyphenyl; and each of R3-R5 is H or ≤9C alkyl and at least 2 of them is H. The photopolymerization initiator is embodied by an azido compound having a chalcon structure, and the radical polymerization initiator is embodied by benzoyl peroxide and p-chlorobenzoyl peroxide and the like, and the cured resin composition can be enhanced in heat resistance by introducing polymaleimido derivatives having curable unsaturated double bonds in the side chains.
AMO SATORU
KAWAI YOSHINORI
SATSUU YUUICHI
MIWA TAKAO
TAKAHASHI AKIO
