Title:
CURABLE RESIN COMPOSITION
Document Type and Number:
Japanese Patent JP2009191203
Kind Code:
A
Abstract:
To provide a curable resin composition curable at a low temperature and in a short time, further excellent in adhesion properties to polyimide and moist-heat resistance.
The curable resin composition includes an epoxy resin (A), a styrene-butadiene-methyl methacrylate terpolymer (B), and at least one kind of polymer (C) selected from the group consisting of polyester urethane, polyether ester-amide, and polyester amide in which the acid number is 5 KOH mg/g.
Inventors:
SEKINE YUKO
SATO NAO
ISHIKAWA KAZUNORI
HOSODA HIROYUKI
SATO NAO
ISHIKAWA KAZUNORI
HOSODA HIROYUKI
Application Number:
JP2008034806A
Publication Date:
August 27, 2009
Filing Date:
February 15, 2008
Export Citation:
Assignee:
YOKOHAMA RUBBER CO LTD
International Classes:
C08G59/40; C08L53/02; C08L63/00; C08L71/00; C08L75/06
Domestic Patent References:
| JP2008222906A | 2008-09-25 | |||
| JP2012007170A | 2012-01-12 | |||
| JP2008222906A | 2008-09-25 | |||
| JP2012007170A | 2012-01-12 |
Attorney, Agent or Firm:
Nozomi Watanabe
Haruko Sanwa
Haruko Sanwa