Title:
CURABLE RESIN COMPOSITION
Document Type and Number:
Japanese Patent JP2015074776
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a curable resin composition which has high adhesiveness to plastic materials or metallic members, shows high holding power in durability tests including high-temperature tests, enables formation of a cured product suppressed thoroughly in deformation accompanied with fluidization, deterioration and coloring on heating and is good in compatibility.SOLUTION: A curable resin composition comprises: (A) a polyfunctional (meth)acrylate of a molecular weight of 300 to 1,000 having an alicyclic structure; (B) a tackifier of a melting point of 80 to 160°C having an alicyclic structure; and (C) a butadiene-based polymer of a weight average molecular weight of 500 to 10,000 being free of (meth)acrylate groups and having a glass transition temperature of 0°C or lower and has a viscosity of 500 to 500,000 mPa s, measured at 25°C by using a B type viscometer.
Inventors:
MAJIMA YOSHIAKI
TSUJINO YASUNORI
AWAJI TOSHIO
TSUJINO YASUNORI
AWAJI TOSHIO
Application Number:
JP2013214053A
Publication Date:
April 20, 2015
Filing Date:
October 11, 2013
Export Citation:
Assignee:
NIPPON CATALYTIC CHEM IND
International Classes:
C08L9/00; C08K5/103; C08L93/04; C09J4/02; C09J11/06; C09J109/00; C09J155/04