Title:
CURABLE RESIN COMPOSITION
Document Type and Number:
Japanese Patent JP2023103094
Kind Code:
A
Abstract:
To provide a curable resin composition that impregnates a base material easily in preparing a substrate and satisfies all of sufficient low dielectric characteristics, a low linear expansion coefficient, and high copper foil adhesive strength of a cured product.SOLUTION: A curable resin composition contains (A) modified polyphenylene ether, (B) a styrenic elastomer having a content of a random copolymer of a conjugated diene compound and a vinyl aromatic compound of 1% or more and 95% or less, (C) a cross-linking assistant which is an aromatic vinyl compound having vinyl groups of three or less in the molecule, and (D) (a) an acrylic or methacrylic compound having a molecular weight of 400 or less and a sum of an acrylic group or a methacrylic group of three or less in one molecule or (b) a reactive diluent which is a vinyl-group-containing silane compound represented by formula (19) below. {in formula (19), R42 indicates a hydrogen atom or a hydrocarbon having four or less carbon atoms, and n indicates an integer of 2-6}.SELECTED DRAWING: None
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Inventors:
YAMAMOTO HISANAO
FUKUOKA HIROTSUGU
FUKUOKA HIROTSUGU
Application Number:
JP2022003954A
Publication Date:
July 26, 2023
Filing Date:
January 13, 2022
Export Citation:
Assignee:
ASAHI KASEI CORP
International Classes:
C08F290/06; C08F283/08; C08F291/00; C08G65/48; C08J5/24; C08K5/01; C08K5/11; C08K5/5425; C08K7/06; C08L9/06; C08L71/12
Attorney, Agent or Firm:
Atsushi Aoki
Shinji Mihashi
Kazuhiro Nakamura
Miyako Saito
Shunsuke Sanma
Shinji Mihashi
Kazuhiro Nakamura
Miyako Saito
Shunsuke Sanma
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