Title:
CURABLE RESIN COMPOSITION
Document Type and Number:
Japanese Patent JP3216215
Kind Code:
B2
Abstract:
PURPOSE: To provide a curable resin composition composed of a modified polysiloxane compound, an epoxy resin and a curing agent, excellent in mechanical strength, adhesion, moisture resistance, electrical properties, heat shock resistance, etc., and useful in the field of electric and electronic materials.
CONSTITUTION: The objective curable resin composition contains (A) a modified polysiloxane compound synthesized, e.g. by carrying out homopolymerization of a compound (preferably p-t-butoxystyrene, etc.) of formula I (R1 is H or methyl; R2 is a 1 to 6C alkyl) or copolymerization thereof with a copolymerizable compound in the presence of an anionic initiator, then copolymerizing a cyclic siloxane compound therewith and subsequently eliminating a saturated aliphatic protecting group, represented by formula II [X is a polymer block essentially composed of a p-alkenylphenol unit; Y is an organosiloxane block; (n) is 1 to 2; (X/Y) is (1/99) to (90/10)] and having 500 to 100000 number-average molecular weight, (B) an epoxy resin (preferably a bifunctional epoxy resin) and (C) a curing agent (a t-amine, an imidazole, etc.).
Inventors:
Hiroo Muramoto
Hideo Kubo
Isao Kurayama
Hideo Kubo
Isao Kurayama
Application Number:
JP10183492A
Publication Date:
October 09, 2001
Filing Date:
March 27, 1992
Export Citation:
Assignee:
Nippon Soda Co., Ltd.
International Classes:
C08G59/40; C08G59/00; C08L63/00; C08L83/04; C08L83/10; H01L23/29; H01L23/31; (IPC1-7): C08L63/00; C08L83/10
Domestic Patent References:
| JP413714A | ||||
| JP4145129A |
Attorney, Agent or Firm:
Yoshimi Yokoyama (1 person outside)