Title:
CURABLE RESIN COMPOSITION
Document Type and Number:
Japanese Patent JP3789867
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a curable resin composition that has overcome a problem of surface tackiness after the curing for the conventional modified silicone sealant and has lower contamination than that.
SOLUTION: The curable resin composition contains 100pts.wt. of (A) a crosslinking silyl group-containing organic polymer and 0.1-10pts.wt. of (B) a diamine compound represented by formula (1) (wherein, R1 denotes a monovalent 12-21C alliphatic hydrocarbon group which may be branched and R2 denotes a 2-4C alkylene group which may be branched).
Inventors:
Kazunori Ishikawa
Hiroyuki Hosoda
Kenichi Tsubota
Hiroyuki Hosoda
Kenichi Tsubota
Application Number:
JP2002223702A
Publication Date:
June 28, 2006
Filing Date:
July 31, 2002
Export Citation:
Assignee:
THE YOKOHAMA RUBBER CO.,LTD.
International Classes:
C08L101/10; C09K3/10; C08K5/17; C08K5/5419; (IPC1-7): C08L101/10; C08K5/17; C08K5/5419; C09K3/10
Domestic Patent References:
| JP2001164237A | ||||
| JP2002037951A | ||||
| JP2003221575A | ||||
| JP11029713A | ||||
| JP10195309A |
Attorney, Agent or Firm:
Nozomi Watanabe
Haruko Sanwa
Haruko Sanwa