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Title:
硬化性樹脂組成物
Document Type and Number:
Japanese Patent JP4615645
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To obtain a resin composition which is excellent in fluidity and moldability before being cured and is excellent in flexibility and thermal shock resistance after being cured by incorporating a curable resin with a vinyl polymer containing carbosiloxane dendrimer structures as the side chains. SOLUTION: The curable resin used is desirably an epoxy resin, a phenolic resin, an imide resin, or a silicone-epoxy resin. The vinyl polymer contains carbosiloxane dendrimer structures as the side chains, is a polymer obtained by polymerizing 0-99.9 pts.wt. vinyl monomer and 100-0.1 pt.wt. carbosiloxane dendrimer containing a radically polymerizable organic group of formula I. In formula I, Y is a radically polymerizable organic group; R1 is an alkyl or an aryl; and X1 is a group of formula II (wheretn R2 is an alkylene; R3 is an alkyl; Xi+1 is hydrogen, an alkyl, or a silylalkyl; i is a number showing the stratum of the silylalkyl and has a value of 1-10; and ai is an integer of 0-3).

Inventors:
Yoshitsugu Morita
Hiroshi Ueki
Takayuki Aso
Haruhiko Furukawa
Makoto Yoshitake
Application Number:
JP13586599A
Publication Date:
January 19, 2011
Filing Date:
May 17, 1999
Export Citation:
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Assignee:
DOW CORNING CORPORATION
International Classes:
C08L43/04; C08L101/00; C08L57/06; C08L61/06; C08L63/00; C08L79/08; C08L83/00
Domestic Patent References:
JP2000063225A
JP2000103931A
JP2000007916A
JP10324805A
JP3152120A
JP11001530A
Attorney, Agent or Firm:
Shinichi Ogawa
Takashi Noguchi
Kazuhiko Saishita



 
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