Title:
硬化性樹脂組成物
Document Type and Number:
Japanese Patent JP4810875
Kind Code:
B2
Abstract:
A resin composition improved in resistance to crack and having elasticity and high heat resistance, which composition contains a cyanate ester resin (a) having at least two cyanate groups per molecule and a bismaleimide compound (b) represented by the following formula (1), a copper-clad laminate using the above resin composition and a printed wiring board using the above copper-clad laminate, wherein n is an average value and is in the range of from 1 to 30.
Inventors:
Nozaki Mitsuru
Application Number:
JP2005127660A
Publication Date:
November 09, 2011
Filing Date:
April 26, 2005
Export Citation:
Assignee:
Mitsubishi Gas Chemical Co., Ltd.
International Classes:
B32B7/04; C08L79/04; B32B27/04; C08F22/40; C08G73/06; C08G73/12; H05K1/03
Domestic Patent References:
| JP2001501230A | ||||
| JP6345864A | ||||
| JP7188149A | ||||
| JP61055121A | ||||
| JP6306167A |
Attorney, Agent or Firm:
Takashi Nagai