Title:
硬化性樹脂組成物
Document Type and Number:
Japanese Patent JP6909967
Kind Code:
B2
Abstract:
A liquid thermally expandable curable resin composition for use such as bonding by filling a clearance has difficulty in achieving both drying property and film forming property and also has a problem with storage stability. The problems were solved with a curable resin composition having the following composition. A curable resin composition comprises: (A) a film forming resin, (B) an epoxy resin, (C) an organic solvent, (D) thermally expandable particles, and (E) a curing agent ingredient for the (B). The (C) is selected from organic solvents having a boiling point of 100°C or less and being liquid at normal temperature and contains a combination of (C-1) an ester-based solvent and (C-2) one or more solvents selected from ketone-based solvents, ether-based solvents, and glycol-based solvents, and a content ratio between the (C-1) and the (C-2) in a mass ratio is in a range of (C-l)/(C-2) = 0.12 to 0.23.
Inventors:
Tatsuya Kuroda
Application Number:
JP2018546279A
Publication Date:
July 28, 2021
Filing Date:
October 12, 2017
Export Citation:
Assignee:
ThreeBond Co., Ltd.
International Classes:
C08L63/00; C08L71/00; C09J11/06; C09J11/08; C09J163/00; C09J171/00
Domestic Patent References:
| JP2007106963A | ||||
| JP2016074849A |
Foreign References:
| CN105969162A | ||||
| CN104927738A | ||||
| CN103483888A | ||||
| WO2014134738A1 |
Attorney, Agent or Firm:
Shinichiro Tanaka
▲吉▼田 和彦
Hiroyuki Suda
Kazuo Yamazaki
Satsuki Ichikawa
Hironobu Hattori
▲吉▼田 和彦
Hiroyuki Suda
Kazuo Yamazaki
Satsuki Ichikawa
Hironobu Hattori