Title:
硬化性樹脂組成物
Document Type and Number:
Japanese Patent JP7212323
Kind Code:
B2
Abstract:
Provided are: a curable resin composition which gives cured objects combining excellent heat resistance with dielectric properties; a cured object obtained from the curable resin composition; a prepreg which attains these performances; a circuit board; a build-up film; a semiconductor encapsulant; and a semiconductor device. The curable resin composition of the present invention is characterized by comprising a maleimide (A) having an indane skeleton and a diene-based polymer (B).
Inventors:
Tomohiro Shimono
Tatsuya Okamoto
Tatsuya Okamoto
Application Number:
JP2021515832A
Publication Date:
January 25, 2023
Filing Date:
February 20, 2020
Export Citation:
Assignee:
DIC Corporation
International Classes:
C08F279/02; B32B15/08; B32B15/088; C08J5/24; H01L23/29; H01L23/31; H05K1/03; H05K3/46
Domestic Patent References:
| JP2009035710A | ||||
| JP64026555A | ||||
| JP63275562A | ||||
| JP2018012671A |
Foreign References:
| WO1993012933A1 |
Attorney, Agent or Firm:
Patent Attorney Corporation Junias International Patent Office
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