Title:
CURABLE RESIN COMPOSITION
Document Type and Number:
Japanese Patent JPH04170418
Kind Code:
A
Abstract:
PURPOSE:To obtain the title compsn. giving a coating film excellent in adhesion to a molded surface having a minute pores and uneveness by incorporating a urethane (meth)acrylate obtd. by reacting a specific diisocyanate, a specific diol compd., and a specific (meth)acrylate in a specified ratio into the compsn. CONSTITUTION:The title compsn. contains a urethane (meth)acrylate obtd. by reacting a diisocyanate having a cyclohexane ring in the molecule (e.g. isophorone diisocyanate), a diol compd. of formula I [wherein m and n are each 0-10; and R1 is 1-6C divalent alkyl, a group of formula II (wherein R2 and R3 are each 2-10C divalent alkyl), or a group of formula III (wherein R4 is R2)], and a hydroxylated (meth)acrylate (e.g. 2-hydroxyethyl acrylate) in such a molar ratios among the molar number of NCO groups in the diisocyanate (X), that of OH groups in the diol compd. (Y), and that of OH groups in the (meth)acrylate (Z) as to satisfy X/Y=5/4-16/5 and Z>=(X-Y).
Inventors:
TAKAMATSU YUKISHIGE
NIIMOTO MASAKI
SATO MITSUO
NIIMOTO MASAKI
SATO MITSUO
Application Number:
JP29362290A
Publication Date:
June 18, 1992
Filing Date:
November 01, 1990
Export Citation:
Assignee:
MITSUBISHI RAYON CO
International Classes:
C08G18/32; C08G18/67; C08G18/73; C08G18/75; C09D175/00; C09D175/06; (IPC1-7): C08G18/32; C08G18/67; C08G18/75; C09D175/06
Attorney, Agent or Firm:
Wakabayashi Tadashi