Title:
CURABLE RESIN LAMINATE, DRY FILM, CURED PRODUCT, AND ELECTRONIC COMPONENT
Document Type and Number:
Japanese Patent JP2022157693
Kind Code:
A
Abstract:
To provide a curable resin laminate useful for forming an insulating layer which has low dielectric characteristics and excellent adhesion (peel strength) to a conductor layer.SOLUTION: The curable resin laminate includes a first resin layer and a second resin layer laminated on the first resin layer. The second resin layer has a thickness of 5-35% of the total thickness of the first resin layer and the second resin layer. A first curable composition contains (A1) a polyphenylene ether and a filler. A second curable composition contains (A2) a polyphenylene ether. The melt viscosity (MV2) at 140°C of the second resin layer is 40,000 dPa s or less. The relationship between the melt viscosity (MV1) at 140°C of the first resin layer and the melt viscosity (MV2) at 140°C of the second resin layer is MV1>MV2. (A1) and (A2) have slopes calculated from conformation plots of less than 0.6.SELECTED DRAWING: None
Inventors:
MISHIMA SHOKO
SEKIGUCHI SHOYA
OSHIRO KOTA
ISHIKAWA NOBUHIRO
SEKIGUCHI SHOYA
OSHIRO KOTA
ISHIKAWA NOBUHIRO
Application Number:
JP2021062055A
Publication Date:
October 14, 2022
Filing Date:
March 31, 2021
Export Citation:
Assignee:
TAIYO HOLDINGS CO LTD
International Classes:
B32B27/00; B32B27/20; C08G65/44
Attorney, Agent or Firm:
Atsushi Ito
Previous Patent: Polyimide, polyamic acid and polyimide film
Next Patent: Curable resin laminates, dry films and cured products, electronic components
Next Patent: Curable resin laminates, dry films and cured products, electronic components