硬化性半導体組成物 - Dow Global Technologies LLC

Title:

硬化性半導体組成物

Document Type and Number:

Japanese Patent JP7181869

Kind Code:

B2

Abstract:

A rubberless, strippable, semiconducting composition that includes an ethylene-(carboxylic ester) copolymer having a low comonomeric unit content, carbon black, and a strippability additive combination comprising an amide wax and a silicone oil. Also provided are a cured product made from the composition, methods of making and using same, and articles containing same.

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Inventors:

Ichi Dwan
Timothy Jay Person
Shrikant Dodpkar
Remi A. Trottier

Application Number:

JP2019531409A

Publication Date:

December 01, 2022

Filing Date:

December 14, 2017

Export Citation:

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Assignee:

Dow Global Technologies LLC

International Classes:

C08L31/04; C08K3/014; C08K3/04; C08K5/14; C08K5/20; C08L83/04

Domestic Patent References:

JP2000030532A
JP11353943A
JP58061501A
JP2007509195A

Foreign References:

US20060246286

Attorney, Agent or Firm:

Hiroshi Kobayashi
Eiji Katayama
Norio Omori
Yasuhito Suzuki

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