Title:
CURABLE SILICONE COMPOSITION AND SILICONE RESIN CURED PRODUCT
Document Type and Number:
Japanese Patent JP2012121950
Kind Code:
A
Abstract:
To provide a curable silicone composition providing a cured product having all of film formability, toughness of a poly(meth)acrylate and thermal stability of a silicone, and to provide a cured silicone resin product by curing the composition.
The curable silicone composition comprises (A) a polymer of a (meth)acrylate having at least one hydrogen atom bonded to a silicon atom (Si-H group) in one molecule, or a copolymer of a (meth)acrylate having at least one Si-H group in one molecule with at least one selected from (meth)acrylates and siloxane containing (meth)acrylates, (B) an organopolysiloxane having at least two alkenyl groups bonded to a silicon atom in one molecule, and (C) a catalyst for hydrosilylation reaction.
More Like This:
Inventors:
TEZUKA HIROAKI
KOZAI TOSHIYUKI
KOZAI TOSHIYUKI
Application Number:
JP2010272113A
Publication Date:
June 28, 2012
Filing Date:
December 07, 2010
Export Citation:
Assignee:
SHINETSU CHEMICAL CO
International Classes:
C08L83/07; C08F30/08; C08L43/04
Domestic Patent References:
| JP2006063092A | 2006-03-09 | |||
| JPH08295783A | 1996-11-12 |
Attorney, Agent or Firm:
Takashi Kojima
Saori Shigematsu
Katsunari Kobayashi
Takeshi Ishikawa
Saori Shigematsu
Katsunari Kobayashi
Takeshi Ishikawa
Previous Patent: PRESSURE-SENSITIVE ADHESIVE, AND LAMINATE USING THE SAME
Next Patent: RESIN COMPOSITION FOR FORMING INKJET FLOW PATH
Next Patent: RESIN COMPOSITION FOR FORMING INKJET FLOW PATH