Title:
CURED BODY, RESIN MATERIAL AND MULTILAYER PRINTED BOARD
Document Type and Number:
Japanese Patent JP2019173009
Kind Code:
A
Abstract:
To provide a cured body that 1) can lower a dielectric loss tangent and can improve 2) thermal dimensional stability, 3) elastic moduli, 4) plating peel strength, 5) adhesion between an insulating layer and a metal layer.SOLUTION: The present invention provides a cured body of a resin material containing a bismaleimide compound or bisbenzoxazine compound, an epoxy compound, and an inorganic filler, the cured body having a sea-island structure having a sea part and an island part.SELECTED DRAWING: Figure 1
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Inventors:
KAWAHARA YUKO
HAYASHI TATSUJI
BABA SUSUMU
HAYASHI TATSUJI
BABA SUSUMU
Application Number:
JP2019061452A
Publication Date:
October 10, 2019
Filing Date:
March 27, 2019
Export Citation:
Assignee:
SEKISUI CHEMICAL CO LTD
International Classes:
C08G59/40; B32B15/08; B32B15/088; B32B15/092; C08G14/073; C08G73/12; C08K3/00; C08K3/013; C08K5/00; C08K5/3415; C08K5/3445; C08L61/34; C08L63/00; C08L79/08; C08L101/00; H05K3/46
Domestic Patent References:
| JP2019044180A | 2019-03-22 | |||
| JP2016131243A | 2016-07-21 | |||
| JP2018502937A | 2018-02-01 | |||
| JP2019044128A | 2019-03-22 | |||
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Foreign References:
| WO2017027482A1 | 2017-02-16 | |||
| US20150045517A1 | 2015-02-12 |
Attorney, Agent or Firm:
Patent business corporation Miya saki, table of contents patent office