Title:
金属板付熱伝導性シートの硬化物および熱伝導性シートの硬化物の製造方法
Document Type and Number:
Japanese Patent JP7369787
Kind Code:
B2
Abstract:
There is provided a thermally conductive sheet with a metal plate including: a metal plate; and a thermally conductive sheet laminated on the metal plate and containing a thermosetting resin and boron nitride particles, in which an average particle size of the boron nitride particles is 10 um or more and 100 um or less, and an amount of warpage of the thermally conductive sheet when the metal plate is removed is 0.15 mm or more and 1.30 mm or less.
Inventors:
Mika Kagawa
Application Number:
JP2021555236A
Publication Date:
October 26, 2023
Filing Date:
May 17, 2021
Export Citation:
Assignee:
Sumitomo Bakelite Co., Ltd.
International Classes:
H01L23/36; C08K3/38; C08L101/00; H05K7/20
Domestic Patent References:
| JP2012039061A | ||||
| JP2008010897A |
Attorney, Agent or Firm:
Shinji Hayami