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Title:
Curing accelerator for epoxy resin, epoxy resin composition and electronic component equipment
Document Type and Number:
Japanese Patent JP6291729
Kind Code:
B2
More Like This:
JPH06211968PHENOL RESIN COMPOSITION
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JP6511840Epoxy resin composition, film-like epoxy resin composition and electronic component equipment
Inventors:
Shinya Nakamura
Hidetoshi Inoue
Application Number:
JP2013126047A
Publication Date:
March 14, 2018
Filing Date:
June 14, 2013
Export Citation:
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Assignee:
Hitachi Chemical Co., Ltd.
International Classes:
C08G59/62; C07F9/54; H01L23/29; H01L23/31
Domestic Patent References:
JP2015858A
JP2003147053A
JP2004176039A
JP2005105078A
JP2015941A
Attorney, Agent or Firm:
Patent Service Corporation Taiyo International Patent Office



 
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