CURING AGENT AND CURE ACCELERATOR FOR RESIN AND RESIN COMPOSITION

Japanese Patent JP2000080154

A

To provide a curing agent and a cure accelerator reduced in the tendency to sublime or to decompose and giving a resin composition having improved heat stability and a prolonged pot life when added to a resin by selecting a clathrate compound of a tetrakisphenol compound with a special organic compound.

The tetrakisphenol compound is represented by formula I (wherein X is (CH2)n; n is 0, 1, 2, or 3; and R1 to R8 are each hydrogen, a lower alkyl, a (substituted) phenyl, a halogen, or a lower alkoxyl). The organic compound used is represented by formula II (wherein R9 to R12 are each hydrogen, a lower alkyl, a (substituted) phenyl, or a heterocyclic group or a lower alkoxyl, provided that R9 and R11 together with the carbon and nitrogen atoms to which they are attached may form a five- to ten-membered ring, and R10 and R12 together with the nitrogen atoms to which they are attached may form a five- to seven-membered heterocyclic ring containing still another ring nitrogen atom).

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AMAIKE MASATO
SASAOKA SEIJI
ABE SATORU

JP18547699A

March 21, 2000

June 30, 1999

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NIPPON SODA CO

C07C39/15; C07C257/10; C08G59/50; C08G59/62; C08K5/13; C08K5/29; (IPC1-7): C08G59/62; C08G59/50; C08K5/13; C08K5/29

JPH05194711A	1993-08-03
JPH05201902A	1993-08-10
JPH06166646A	1994-06-14
JPH054978A	1993-01-14
JPH10324826A	1998-12-08
JP3904311B2	2007-04-11
JPH08239452A	1996-09-17
JPH07330870A	1995-12-19

Yusaku Tokai (1 person outside)

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