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Patent Searching and Data


Title:
CURING COMPOSITION
Document Type and Number:
Japanese Patent JP2000154224
Kind Code:
A
Abstract:

To provide a thermosetting composition which gives a curing substance of a phenolic resin with flexibility.

A composition contains (A) a vinyl polymer having at least one phenol group at the terminal of main chain and (B) a phenolic resin and a polymer prepared by reacting (A) a vinyl polymer having at least one phenol group at the terminal of main chain with (C) an aldehyde compound.


Inventors:
KITANO KENICHI
NAKAGAWA YOSHIKI
Application Number:
JP25994399A
Publication Date:
June 06, 2000
Filing Date:
September 14, 1999
Export Citation:
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Assignee:
KANEKA CORP (JP)
International Classes:
C08L57/10; C08F2/00; C08F4/10; C08F4/40; C08F8/00; C08G8/38; C08G81/02; C08L61/06; (IPC1-7): C08G8/38; C08F8/00; C08G81/02; C08L57/10; C08L61/06
Attorney, Agent or Firm:
Yasuo Yasutomi (2 outside)