To provide a current lead for supercunducting device wherein the amount of thermal infiltration into an ultra-low temperature part is reduced.

A high temperature superconductor 222 is installed to a groove 30 formed at a low temperature terminal 21 of the low temperature side lead of a superconducting device current lead for soldering, while at a groove or hole 61 formed on at least one surface of the low temperature terminal 21, at least one metal group superconductor 60 from the coil terminal of a superconducting coil is provided, so as to wrap the high temperature superconductor 222 in the axial direction for soldering. As a result, the electrical resistance between the low temperature terminal 21 and the coil terminal becomes a parallel resistance between the contact resistance due to surface-contact of each terminal and the resistance of the metal group superconductor (including the resistance part of each soldering part), and electrical resistance is reduced.