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Title:
CUTTER FOR SEMICONDUCTOR WAFER
Document Type and Number:
Japanese Patent JPS6078710
Kind Code:
A
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Inventors:
KAMITAKI YUUJI
Application Number:
JP18809083A
Publication Date:
May 04, 1985
Filing Date:
October 04, 1983
Export Citation:
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Assignee:
MITSUBISHI ELECTRIC CORP
International Classes:
B23Q17/09; B23Q17/00; B28D5/02; H01L21/301; H01L21/78; (IPC1-7): B23Q17/00; B28D5/02; H01L21/78
Attorney, Agent or Firm:
Masuo Oiwa



 
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