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Patent Searching and Data


Title:
CUTTING DEVICE FOR SUBSTRATE
Document Type and Number:
Japanese Patent JPH10202597
Kind Code:
A
Abstract:

To provide a device which is appropriate for multi-type low-volume production by fitting a punch fitting means which can replace a punch easily by opening and closing a punch presser at a punch part, in a device involving the punch part and a dies part.

This device is mainly constituted of a conveyance system for substrate and a cutter. The cutter is formed with a punch part 18, and a dies part 19 which is formed onto a supporting mount so as to face the punch part 18 vertically. After the punch part 18 sandwiches a substrate between a substrate presser formed at the front end of a punch body 20 and a substrate presser formed at the front end of the dies part 19, a punch 25 lowers and cuts the substrate. The punch part 18 is also formed with the shaft jointing part 21 of a press part 19, and punch fitting means, such as a punch supporting part 36 and a punch press 38 and the like which are formed at its lower part. In replacing the punch 25 after the cutting of one pattern substrate is completed, it is possible to replace it easily by opening the punch presser 38. It is possible to obtain a device which is appropriate for multi-type low-volume production.


Inventors:
FURUSAWA TAKASHI
MIYANAGA TOSHIHISA
SAITO RYOJI
Application Number:
JP1763297A
Publication Date:
August 04, 1998
Filing Date:
January 17, 1997
Export Citation:
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Assignee:
NIKKO IND CORP
International Classes:
B26F1/14; H05K3/00; (IPC1-7): B26F1/14; H05K3/00