Title:
CUTTING DEVICE OF WASTE ELECTRIC APPLIANCE, AND COLLECTING METHOD FOR RECYCLING WASTE ELECTRIC APPLIANCE USING THE CUTTING DEVICE
Document Type and Number:
Japanese Patent JP2009214174
Kind Code:
A
Abstract:
To efficiently sort and collect specified parts and members in a recycling process in which various waste electric appliances are treated at random.
In a cutting method, the output state of laser beam 3 is detected when outputting the laser beam 3 to a workpiece, and a reference value is established, which determines based on the result of detection whether or not the output state of the laser beam 3 is in a normal operational range. When the result of detection exceeds the reference value, the output state of the laser beam 3 is determined to be abnormal, and the output of the laser beam 3 is controlled to stop or guided in a normal operational range.
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Inventors:
TSUTSUMI TSUNEKATA
SAKAI YASUHIKO
YOKOYAMA HIDEKI
KONDO MASAKI
SAKAI YASUHIKO
YOKOYAMA HIDEKI
KONDO MASAKI
Application Number:
JP2008063654A
Publication Date:
September 24, 2009
Filing Date:
March 13, 2008
Export Citation:
Assignee:
PANASONIC CORP
International Classes:
B23K26/00; B02C23/08; B09B3/00; B09B5/00; B23K26/38; C22B7/00
Domestic Patent References:
JPH10263518A | 1998-10-06 | |||
JPH0494883A | 1992-03-26 | |||
JPH01178394A | 1989-07-14 | |||
JPH09108861A | 1997-04-28 | |||
JP2002177934A | 2002-06-25 |
Attorney, Agent or Firm:
Fumio Iwahashi
Hiroki Naito
Daisuke Nagano
Hiroki Naito
Daisuke Nagano
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