CUTTING DEVICE OF WASTE ELECTRIC APPLIANCE, AND COLLECTING METHOD FOR RECYCLING WASTE ELECTRIC APPLIANCE USING THE CUTTING DEVICE

Japanese Patent JP2009214174

A

To efficiently sort and collect specified parts and members in a recycling process in which various waste electric appliances are treated at random.

In a cutting method, the output state of laser beam 3 is detected when outputting the laser beam 3 to a workpiece, and a reference value is established, which determines based on the result of detection whether or not the output state of the laser beam 3 is in a normal operational range. When the result of detection exceeds the reference value, the output state of the laser beam 3 is determined to be abnormal, and the output of the laser beam 3 is controlled to stop or guided in a normal operational range.

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TSUTSUMI TSUNEKATA
SAKAI YASUHIKO
YOKOYAMA HIDEKI
KONDO MASAKI

JP2008063654A

September 24, 2009

March 13, 2008

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PANASONIC CORP

B23K26/00; B02C23/08; B09B3/00; B09B5/00; B23K26/38; C22B7/00

JPH10263518A	1998-10-06
JPH0494883A	1992-03-26
JPH01178394A	1989-07-14
JPH09108861A	1997-04-28
JP2002177934A	2002-06-25

Fumio Iwahashi
Hiroki Naito
Daisuke Nagano

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