Title:
CUTTING DEVICE
Document Type and Number:
Japanese Patent JP2022030669
Kind Code:
A
Abstract:
To provide a cutting device capable of automatically exchanging a board.SOLUTION: A cutting device for cutting a workpiece with a cutting blade, includes: a cutting unit having: a chuck table that holds a board in which a groove is formed by being cut by the cutting blade; a spindle; and a mount flange fixed at a leading end of the spindle and to which the cutting blade is attached; and a replacement device that replaces the cutting blade attached to the mount flange with a cutting blade stored in a blade storage unit and also replaces the board placed on the chuck table with a board stored in a board storage unit; where the replacement device includes a holding unit that sucks and holds the cutting blade and the board; and where the holding unit includes a blade suction pad that sucks and holds the cutting blade in contact with the cutting blade or in contact with a base for fixing the cutting blade; and a board support portion projecting further outside the holding unit than a leading end of the blade suction pad.SELECTED DRAWING: Figure 6
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Inventors:
TERADA KAZUTAKA
Application Number:
JP2020134817A
Publication Date:
February 18, 2022
Filing Date:
August 07, 2020
Export Citation:
Assignee:
DISCO ABRASIVE SYSTEMS LTD
International Classes:
B24B45/00; B23Q3/155; B24B27/00; B24B53/00; B24B53/12; H01L21/301
Attorney, Agent or Firm:
Matsumoto
Tomohiro Okamoto
Takahiro Kasahara
Hideaki Okamoto
Takayuki Okano
Tomohiro Okamoto
Takahiro Kasahara
Hideaki Okamoto
Takayuki Okano