Title:
CUTTING DEVICE
Document Type and Number:
Japanese Patent JP2023058870
Kind Code:
A
Abstract:
To provide a cutting device which suppresses sawdust scattering when performing dry type cutting by a wire saw tool.SOLUTION: A cutting device 1 comprises: a frame 7 which holds a pair of pulleys 13T, 13T for cutting; a wore saw tool 9 which travels between the pulleys 13T, 13T for cutting; a hydraulic cylinder 41 which moves the frame 7 relatively to a segment 125 so that the segment 125 as an object to be cut traverses between the pulleys 13T, 13T for cutting; and curing sheets 27, 29 which move so as to overlay on a surface of the segment 125 in association with movement of the frame 7 with respect to the segment 125, and cover a cut groove 125j which is formed in the segment 125 by the wire saw tool 9.SELECTED DRAWING: Figure 2
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Inventors:
KAMIO HIROYUKI
KONYA OSAMU
SAWADA SHOHEI
FURUNO YUDAI
YASUKOCHI JUNICHI
ANDO YUJI
KAWADA JUNYA
SASE TOMOAKI
SAKURAI NOBUYUKI
IWASAKI ARIHIRO
KONYA OSAMU
SAWADA SHOHEI
FURUNO YUDAI
YASUKOCHI JUNICHI
ANDO YUJI
KAWADA JUNYA
SASE TOMOAKI
SAKURAI NOBUYUKI
IWASAKI ARIHIRO
Application Number:
JP2021168647A
Publication Date:
April 26, 2023
Filing Date:
October 14, 2021
Export Citation:
Assignee:
KAJIMA CORP
MHI SAGAMI HIGH TECHLTD
MHI SAGAMI HIGH TECHLTD
International Classes:
B23D59/00; B23D57/00; B23D61/18; B26D1/46; B28D7/02; E04G23/08; G21F9/30
Attorney, Agent or Firm:
Yoshiki Hasegawa
Yoshiki Kuroki
Hiroshi Kondo
Yoshiki Kuroki
Hiroshi Kondo
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