Title:
切削装置、切削方法及び環状工具
Document Type and Number:
Japanese Patent JP6710902
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a cutting device and method capable of fragmenting swarf generated during a cutting process and improving a tool life, and to provide an annular tool used in the cutting device and method.SOLUTION: In a cutting device (1), a tool main shaft (71) and a rotary main shaft (11) (workpiece holding base) are disposed in a relative physical relationship in which: the outer peripheral face of the annular tool (90A, 90B or 90C) becomes a cutting face (91Ab, 91Bb or 91Cb); and the end face of the annular tool (90A, 90B or 90C) becomes a flank (91Ac, 91Bc or 91Cc). A workpiece (W) is processed using the annular tool (90A, 90B or 90C) while changing a rake angle (φ) formed by the cutting face (91Ab, 91Bb or 91Cb) in the rotative direction (rt) of the annular tool (90A, 90B or 90C).SELECTED DRAWING: Figure 4A
Inventors:
Takayuki Higashi
Hiroshi Watanabe
Hiroshi Watanabe
Application Number:
JP2015123064A
Publication Date:
June 17, 2020
Filing Date:
June 18, 2015
Export Citation:
Assignee:
JTEKT Corporation
International Classes:
B23B1/00; B23B27/08
Domestic Patent References:
| JP11509899A | ||||
| JP2014240119A | ||||
| JP5023901A | ||||
| JP6023603A | ||||
| JP53137482A | ||||
| JP2500351A | ||||
| JP2006068831A |
Foreign References:
| WO1996027072A1 |
Attorney, Agent or Firm:
Kiichi Yamamoto
Kobayashi Osamu
Kimura Gunji
Kobayashi Osamu
Kimura Gunji