Title:
切削装置
Document Type and Number:
Japanese Patent JP7060943
Kind Code:
B2
Abstract:
A cutting apparatus includes a chuck table for holding a workpiece thereon, a cutting unit for cutting the workpiece held on the chuck table with a cutting blade secured in place on a distal-end portion of a spindle by a mount flange mounted on the distal-end portion of the spindle, an indexing feed unit for moving the cutting unit in indexing feed directions parallel to axial directions of the spindle, a processing feed unit for moving the chuck table in processing feed directions perpendicular to the indexing feed directions, and an end face correction unit for correcting an end face of the mount flange that supports the cutting blade in contact therewith. The processing feed unit includes a table moving base that supports the chuck table thereon and an actuating mechanism for moving the table moving base. The end face correction unit is fixedly mounted on the table moving base.
Inventors:
Kazuma Sekiya
Application Number:
JP2017221030A
Publication Date:
April 27, 2022
Filing Date:
November 16, 2017
Export Citation:
Assignee:
Disco Co., Ltd.
International Classes:
B24B27/06; B24B41/06; B24B45/00; H01L21/301
Domestic Patent References:
| JP2011255458A | ||||
| JP2011224666A | ||||
| JP2010069601A |
Attorney, Agent or Firm:
Sakai International Patent Office
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