Title:
CUTTING LIQUID COMPOSITION FOR FIXED ABRASIVE GRAIN WIRE SAW
Document Type and Number:
Japanese Patent JP2015127363
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a cutting fluid composition for a fixed abrasive grain wire saw, which exhibits, when cutting a silicon ingot, good dispersibility of cutting powder and permeability into a cut part.SOLUTION: Provided is a cutting fluid composition for a fixed abrasive grain wire saw, comprising a cutting fluid base (component A), at least one surfactant (component B) selected from anionic surfactants, cationic surfactants, and nonionic surfactants having a cloud point of 65°C or more, and water (component C), where viscosity of the composition at 25°C is 1 mPa s or more and 25 mPa s or less, and a total content of the component A is 50 mass% or more and 85 mass% or less. The component A contains both of R-O-(CH-CH-O)-H and R-O-(CH-CH(CH)-O)-H, and the cloud point of the component A is a value in a range of 30°C or more and less than 65°C. Here, the Rand Reach represent an alkyl group having 3 to 8 carbon atoms; p and q represent an average number of moles of addition; and p is an integer between 3 and 6, and q is an integer between 1 and 6.
Inventors:
SATA SHINICHI
KASHIHARA EIJI
TAKAHASHI KATSURA
TOSHIMA KIYOTO
KASHIHARA EIJI
TAKAHASHI KATSURA
TOSHIMA KIYOTO
Application Number:
JP2013272899A
Publication Date:
July 09, 2015
Filing Date:
December 27, 2013
Export Citation:
Assignee:
KAO CORP
PALACE CHEMICAL CO LTD
PALACE CHEMICAL CO LTD
International Classes:
C10M173/02; B24B27/06; B24B57/02; B28D5/04; C10M105/18; H01L21/304
Attorney, Agent or Firm:
Ikeuchi, Sato & Partners