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Title:
CUTTING METHOD BY LASER BEAM GAS
Document Type and Number:
Japanese Patent JPH07100684
Kind Code:
A
Abstract:

PURPOSE: To improve cutting efficiency and reduce the cutting cost by performing the cutting while adding the specific quantity of a powdery element producing the oxide being apt to sublimate or its compound in assist oxygen gas.

CONSTITUTION: At the time of cutting by laser beam gas, the cutting is performed while adding >10mg/sec of a powdery element producing the oxide being apt to sublimate or its compound in assist oxygen gas. However, since there is the possibility that the converging characteristic, etc., of the laser beam are impeded by a large quantity of adding the element, an upper limit is set to almost 20g/sec. A substance having such a property is a compound of, for instance, WC, W2C, Mo2C, CaCO3, etc., and a simple substance of W Mo, etc. Also, it is desirable to use grain powder with a grain size of almost 100 to 250 mesh. Consequently, the attachment of dross can be prevented in the case of cutting a thick plate by laser beam gas.


Inventors:
SAITO NAOKI
YAMABA RYOTA
Application Number:
JP27292993A
Publication Date:
April 18, 1995
Filing Date:
October 06, 1993
Export Citation:
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Assignee:
NIPPON STEEL CORP
International Classes:
B23K26/38; B23K26/14; (IPC1-7): B23K26/00; B23K26/14
Attorney, Agent or Firm:
Masamitsu Akizawa (1 person outside)