Title:
CUTTING METHOD AND DEVICE OF PLATE-LIKE WORK
Document Type and Number:
Japanese Patent JP3553675
Kind Code:
B2
Abstract:
PURPOSE: To enable a work such as a wafer to be effectively cut into pieces with blades.
CONSTITUTION: A first blade 13 is moved forward in a cutting direction to cut a wafer W, and the first blade 13 stops moving when a second blade 14 moving synchronous with the first blade 13 is positioned over a space S on a cutting start side, and the second blade 14 is moved to approach the space S on a cutting start space S. The blades 13 and 14 are moved to advance for cutting the wafer W at the same time, the second blade 14 stops moving when the first blade 13 reaches a space S on a cutting stop side, the first blade 13 is moved away from the space S on a cutting stop side, and the second blade 14 is moved to the space S on a cutting stop side so as to cut the wafer W.
Inventors:
Yoshiyuki Abe
Application Number:
JP3274395A
Publication Date:
August 11, 2004
Filing Date:
February 21, 1995
Export Citation:
Assignee:
Renesas Technology Corp.
International Classes:
B28D5/02; H01L21/301; (IPC1-7): H01L21/301; B28D5/02
Domestic Patent References:
| JP54087170A | ||||
| JP61144648U |
Attorney, Agent or Firm:
Yamato Tsutsui