CUTTING METHOD FOR LAMINATED SHEET AND HALF-CUT DEVICE USED THEREIN

Title:

CUTTING METHOD FOR LAMINATED SHEET AND HALF-CUT DEVICE USED THEREIN

Document Type and Number:

Japanese Patent JP2004034319

Kind Code:

A

Abstract:

To provide a cutting method for a laminated sheet, increasing the production efficiency of a laminated board and a laminated electronic part to a large extent and performing cutting so as to form a highly accurate finish surface.

Cuts V and V are provided with a prescribed pitch to the upper and rear surfaces of a laminated sheet W, and the laminate sheet W after baking is divided from the cuts V and V. In this cutting method of the laminated sheet W, a pair of cutting blades are arranged on the same axis so as to hold the laminated sheet and dividing cuts V and V of a predetermined depth are provided to the same positions of the upper and rear surfaces of the laminated plate W by the pair of the cutting blades C and C. The laminated sheet is divided from the cuts V and V by a cutting whetstone G.

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Inventors:

YASOTA HISASHI
TSUCHIDA TAKASHI

Application Number:

JP2002190355A

Publication Date:

February 05, 2004

Filing Date:

June 28, 2002

Export Citation:

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Assignee:

UHT CORP

International Classes:

B26D3/08; B23D1/00; B26D1/06; B26D3/00; B26D7/06; B28B11/14; H05K3/00; (IPC1-7): B28B11/14; B26D3/08; B26D7/06; H05K3/00

Attorney, Agent or Firm:

Sadayuki Hosoi
Mitsuo Chonan
Ishiwatari Eibo

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