Title:
CUTTING METHOD, OPTICAL ELEMENT AND DIE FOR MOLDING IT
Document Type and Number:
Japanese Patent JP3689622
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide an environmentally-friendly cutting method capable of achieving a high cutting accuracy.
SOLUTION: The cutting method includes causing relative microscopic vibrations of a cutting tool 2 and a workpiece 1 such that the workpiece 1 is cut by the cutting tool. The workpiece 1 is positioned within a processing liquid container 13 holding a working fluid 15 for providing lubrication between the tool 2 and the workpiece, and cutting is effected while the portion to be cut of the workpiece is located within the working fluid.
Inventors:
Takao Yokomatsu
Application Number:
JP2000267392A
Publication Date:
August 31, 2005
Filing Date:
September 04, 2000
Export Citation:
Assignee:
Canon Inc
International Classes:
B23Q11/10; B23B1/00; B23B5/36; B23B25/00; B23Q5/50; B23Q11/14; (IPC1-7): B23B1/00; B23B25/00; B23Q5/50; B23Q11/10; B23Q11/14
Domestic Patent References:
| JP7068401A | ||||
| JP1188247A | ||||
| JP5096409A | ||||
| JP6210542A | ||||
| JP3068756U | ||||
| JP6319905A | ||||
| JP7185993A | ||||
| JP61142002A | ||||
| JP7164201A | ||||
| JP11300757A | ||||
| JP10166202A |
Attorney, Agent or Firm:
Yasunori Otsuka
Yukio Maruyama
Yasuhiro Otsuka
Yukio Maruyama
Yasuhiro Otsuka
Previous Patent: IMAGE PROCESSOR, ITS CONTROL METHOD AND METHOD OF IMAGE PROCESSING
Next Patent: X-RAY IMAGING DEVICE
Next Patent: X-RAY IMAGING DEVICE