Title:
CUTTING METHOD
Document Type and Number:
Japanese Patent JP2015214002
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To highly accurately form a groove of a prescribed depth from a top face of a substrate in a workpiece having a laminate formed on the substrate.SOLUTION: A cutting method includes: a cutting mark formation step for allowing a cutting blade 42 having a prescribed outer diameter and rotating to cut at a depth from a laminate 12 side to a substrate 11 and forming a cutting mark 16 elongating in a length direction orthogonal to a thickness direction of the cutting blade 42 and having a substrate cutting mark 18 exposed in a laminate cutting mark 17 in a workpiece 10; a cutting depth calculation step for calculating a cutting depth of the cutting blade 42 into the substrate 11 on the basis of a distance L in the length direction of the substrate cutting mark 18 and the outer diameter of the cutting blade 42; and a cutting step for adjusting a tip height of the cutting blade 42 on the basis of the cutting depth into the substrate 11, positioning the cutting blade 42 so as to have a prescribed cutting depth in relation to the substrate 11 and cutting the workpiece 10.
Inventors:
TANAKA HIDEAKI
KAMIGAKI MASAYOSHI
KAMIGAKI MASAYOSHI
Application Number:
JP2014099386A
Publication Date:
December 03, 2015
Filing Date:
May 13, 2014
Export Citation:
Assignee:
DISCO ABRASIVE SYSTEMS LTD
International Classes:
B24B27/06; H01L21/301
Domestic Patent References:
JP2011181623A | 2011-09-15 | |||
JP2002059365A | 2002-02-26 | |||
JP2009021476A | 2009-01-29 | |||
JP2001298003A | 2001-10-26 | |||
JP2015142022A | 2015-08-03 |
Foreign References:
US5934973A | 1999-08-10 |
Attorney, Agent or Firm:
Patent Business Corporation Tokyo Alpa Patent Office
Kyoko Kawamura
Isao Sasaki
Ken Kubo
Kyoko Kawamura
Isao Sasaki
Ken Kubo