Title:
CUTTING OR POLISHING SLURRY COMPOSITION AND USE THEREOF
Document Type and Number:
Japanese Patent JP2003138248
Kind Code:
A
Abstract:
To provide a slurry composition which contains abrasive grains but can be left for a long time with no hard sediment formed or no coagulation of grain brought about.
The cutting or polishing slurry composition comprises an abrasive grain and a carrier component for cutting or polishing a work piece made of a hard and brittle material, wherein the carrier component contains (a) a nonaqueous nonionic polar solvent at a content of from 80 wt.% to 99.5 wt.%, (b) an organic electrolyte adjusted to pH 4.5-8 at that of form 0.05 wt.% to 10 wt.%, and (c) water at that of from 0.5 wt.% to 10 wt.%.
Inventors:
BROADWAY SUSAN
FRENCH DANIELLE
HELLER AMY
WARD IRL E
FRENCH DANIELLE
HELLER AMY
WARD IRL E
Application Number:
JP2001318675A
Publication Date:
May 14, 2003
Filing Date:
October 16, 2001
Export Citation:
Assignee:
PPT RES INC
International Classes:
B24B37/00; C09K3/14; H01L21/304; (IPC1-7): C09K3/14; B24B37/00; H01L21/304
Attorney, Agent or Firm:
Yasuo Wada