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Patent Searching and Data


Title:
切削工具製造方法
Document Type and Number:
Japanese Patent JP6980216
Kind Code:
B2
Abstract:
A controller performs a first process of scanning a cylindrical irradiation region including a focused spot of laser light emitted from a laser light emitter to machine a flank face side of a workpiece to manufacture a cutting tool having a plurality of cutting edges arranged in line. In the first process, the controller scans the cylindrical irradiation region along a scanning path that has periodicity and changes a machining depth to form the plurality of cutting edges. The controller further performs a second process of scanning the cylindrical irradiation region including the focused spot of the laser light emitted in a direction different from an irradiation direction of the laser light in the first process to machine a rake face side of the workpiece.

Inventors:
Eiji company book
Itoigawa Fumihiro
Application Number:
JP2020539864A
Publication Date:
December 15, 2021
Filing Date:
February 25, 2019
Export Citation:
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Assignee:
Tokai National University Organization
National Institute of Technology Nagoya Institute of Technology
International Classes:
B23D63/06; B23D65/00; B23K26/00; B23K26/362; B23P15/28
Domestic Patent References:
JP2016159318A
JP2003145344A
JP201340436A
JP20188363A
Other References:
Chun-Wei Liu,外2名,“Diamond turning of high-precision roll-to-roll imprinting molds for fabricating subwavelength gratings”,Optical Engineering,2016年,Vol. 55,No. 6,064105
J Sun,外5名,“Fabrication of periodic nanostructures by single-point diamond turning with focused ion beam built tool tips”,Journal of Micromechanics and Microengineering,Vol. 22,2012年,115014
Hiroshi Saito,外4名,“Mirror Surface Machining of Steel by Elliptical Vibration Cutting with Diamond-Coated Tools Sharpened by Pulse Laser Grinding”,International Journal of Automation Technology,2018年,Vol. 12,No. 4,pp. 573-581
Attorney, Agent or Firm:
Sakaki Morishita