Title:
CUTTING WORKING DEVICE
Document Type and Number:
Japanese Patent JP2019072806
Kind Code:
A
Abstract:
To provide a cutting working device that can reduce influences of a material of an object to be cut in extracting quantities of impact upon cutting the object to be cut.SOLUTION: The cutting working device comprises: a cutting tool; a chuck part; a feeding mechanism; a fixing part to which an object to be cut is fixed; a stage which moves the fixing part at working speed in a direction nearly orthogonal to a rotary shaft of the chuck part; a sensor which is arranged in the fixing part and near a position where the object to be cut is fixed, and which detects vibration of the cutting tool during cutting working of the object to be cut and outputs a monitoring signal; and a control circuit that converts time-waveform data of the monitoring signal to frequency-waveform data, and extracts quantities of impact during the cutting working of the object to be cut, from the frequency-waveform data.SELECTED DRAWING: Figure 1
Inventors:
YAMAZAKI YUJI
TAKESHITA KATSUJI
TAKESHITA KATSUJI
Application Number:
JP2017200899A
Publication Date:
May 16, 2019
Filing Date:
October 17, 2017
Export Citation:
Assignee:
OMRON TATEISI ELECTRONICS CO
International Classes:
B23Q17/12; B23C3/00; B23Q17/09; G01L5/00
Domestic Patent References:
| JP2014014914A | 2014-01-30 | |||
| JPH1133882A | 1999-02-09 | |||
| JPH06320398A | 1994-11-22 | |||
| JP2004017176A | 2004-01-22 | |||
| JP2001030141A | 2001-02-06 | |||
| JP2017156151A | 2017-09-07 | |||
| JP2017094463A | 2017-06-01 | |||
| JP2015229216A | 2015-12-21 | |||
| JPH06344246A | 1994-12-20 |
Foreign References:
| WO2000073018A1 | 2000-12-07 | |||
| WO2013031353A1 | 2013-03-07 | |||
| US20110222980A1 | 2011-09-15 |
Attorney, Agent or Firm:
Fukami patent office