Title:
CYANIC ESTER RESIN, CURABLE RESIN COMPOSITION, CURED MATTER THEREOF, SEMICONDUCTOR SEALING MATERIAL, PREPREG, CIRCUIT BOARD AND BUILD-UP FILM
Document Type and Number:
Japanese Patent JP2013173838
Kind Code:
A
Abstract:
To provide a semiconductor sealing material, prepreg, circuit board and build-up film.
A curable resin composition includes a cyanic ester resin (A) having a resin structure represented by structural formula (I) and a curing promotor (B) as essential components, where in the formula, R1 and R2 are each independently represents H, a 1-4C hydrocarbon group or 1-4C alkoxy group; and n is an integer of 0-10.
Inventors:
SATO YASUSHI
Application Number:
JP2012038715A
Publication Date:
September 05, 2013
Filing Date:
February 24, 2012
Export Citation:
Assignee:
DAINIPPON INK & CHEMICALS
International Classes:
C08G10/02; C08J5/24; C08K3/00; C08K5/00; C08L61/18; C08L63/00; H05K1/03
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Attorney, Agent or Firm:
Kono Tsuyo