Title:
円筒型スパッタリングターゲット及びその製造方法
Document Type and Number:
Japanese Patent JP5622012
Kind Code:
B2
Abstract:
The cylindrical sputtering target is a Cu-Ga alloy cylindrical sputtering target made of a Cu alloy containing 15 atom% to 35 atom% of Ga, in which the Cu alloy has a granular crystal structure.
Inventors:
加藤 慎司
張 守斌
小見山 昌三
張 守斌
小見山 昌三
Application Number:
JP2013240056A
Publication Date:
November 12, 2014
Filing Date:
November 20, 2013
Export Citation:
Assignee:
三菱マテリアル株式会社
International Classes:
C23C14/34; B22D11/00; B22D13/02; C22C1/02; C22C9/00
Attorney, Agent or Firm:
Shuichi Kageyama
Miyake Masayuki
Yasuyuki Kurachi
Kazuo Tomita
Miyake Masayuki
Yasuyuki Kurachi
Kazuo Tomita