Title:
CYNANIDE-FREE PLATING SOLUTION FOR MONOVALENT METAL
Document Type and Number:
Japanese Patent JP3300519
Kind Code:
B2
Abstract:
PURPOSE: To provide an electroplating soln. containing no cyanide.
CONSTITUTION: A soln. for use in electroplating which comprises at least one monovalent metal such as copper, silver or gold complexed by a thiosulfate ion and a stabilizer consisting of an organic sulfinate compound of the formula R-SO2-X (wherein R is an alkyl, heterocyclic or aryl group and X is a monovalent cation) is prepared. The stabilizer is present in an amount suficient to stabilize the thiosulfate ion when the soln. is operated at an acidic pH of less than 7 and the soln. is substantially free of cyanide.
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Inventors:
Fred eye nobel
William Earl Blush
Antony Jay Drago
William Earl Blush
Antony Jay Drago
Application Number:
JP2088994A
Publication Date:
July 08, 2002
Filing Date:
February 18, 1994
Export Citation:
Assignee:
Shipley Company LLC
International Classes:
C25D3/38; C25D3/46; C25D3/48; C25D3/56; (IPC1-7): C25D3/38; C25D3/46; C25D3/48; C25D3/56
Domestic Patent References:
| JP52150744A | ||||
| JP52150745A | ||||
| JP50120435A | ||||
| JP52105540A |
Attorney, Agent or Firm:
Minoru Senda (9 outside)
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