To provide a damping resin composition which excels in damping characteristics, mechanical characteristics, heat stability at the time of molding, and moisture resistance, and which is desirable also in a respect of environment being excellent in flame resisting characteristics without using a halogen compound and an antimony compound.
The damping flame-retardant resin composition includes (a) 10-70 mass% of a polyphenylene ether resin, (b) 0-70 mass% of a styrenic resin, (c) 5-40 mass% of a hydrogenated copolymer, and (d) 1-40 mass% of an organophosphorus compound, wherein the hydrogenated copolymer (c) is a hydrogenated copolymer including a specific hydrogenation random copolymer block (B), in a dynamic viscoelasticity spectrum of the hydrogenated copolymer (c), at least one peak of a loss tangent (tan δ) exists in a range of at least 0°C and less than 50°C, and the organophosphorus compound (d) is expressed by Formula (I). In the formula, A each independently denote a 1-8C alkyl group, a 6-10C aryl group or a 7-12C aralkyl group, R1, R2, R3 and R4 each independently denote a 1-8C alkyl group, a 5-6C cycloalkyl group, a 6-20C aryl group or a 7-12C aralkyl group, x and y each independently 0, 1, 2, 3 or 4, n each independently denote 0 or 1, and N denotes 1-30.
JP2007126520A | 2007-05-24 |
US20030187112A1 | 2003-10-02 |
Toshifumi Onuki
Kazuhiko Naito
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