To reduce the temperature on each circuit board while obtaining a uniform temperature distribution on different circuit boards.
The data acquisition system includes: a main structure with a cavity formed therein, the cavity having a bottom for mounting a circuit board with electrical components thereto; a fan assembly disposed on the main structure; and an airflow guide disposed within the cavity and configured to guide airflow from the fan assembly for heat dissipation of the electrical components, the airflow guide being positioned at a distance above the electrical components so as to form a gap between the airflow guide and the electrical components. A sidewall of the cavity is provided with an air vent corresponding to the gap such that the airflow passes through the gap and is discharged from the air vent.
JOSHI ASHUTOSH
ZHANG XIAOYAN
LIU HAILIANG
LIU ZHUO
JP2007319670A | 2007-12-13 |
US20070280410A1 | 2007-12-06 | |||
US20060126782A1 | 2006-06-15 | |||
US20070284535A1 | 2007-12-13 |
Hirokazu Ogura
Toshihisa Kurokawa
Takuto Tanaka
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