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Patent Searching and Data


Title:
DEFECT OBSERVING METHOD FOR SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JPS63308909
Kind Code:
A
Abstract:

PURPOSE: To obtain a method to find out accurately and easily a part to be re-observed, by supplying a gas containing metal compound, irradiating, via the gas, the vicinity of a part to be observed with a converged ion beam when output energy is adjusted, and forming a metal mark thereon.

CONSTITUTION: When the part 2 to be observed of a semiconductor device 1 to be observed is irradiated with primary ion beam 3, secondary electron 4 is excited and emitted from the part 2 to be observed, and the part 2 to be observed is examined by detecting the secondary electron with an electron microscope. In the case where the later re-observation is required, a gas 8 containing metal compound such as tungsten and molybdenum is supplied to the vicinity of the part 2 to be observed, and, via the gas 8, the vicinity of part 2 to be observed is irradiated with a converged ion beam 6, to form a mark 7. On the occasion of re-observation, the part is irradiated with primary ion beam 3, and then a lot of secondary electrons are excited and emitted from the mark 7. By detecting them with a secondary electron microscope, the position of the mark 7 can be easily recognized. Thereby, the part 2 to be observed necessary for re-observation can be easily found out.


Inventors:
YASUE TAKAO
Application Number:
JP14583787A
Publication Date:
December 16, 1988
Filing Date:
June 10, 1987
Export Citation:
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Assignee:
MITSUBISHI ELECTRIC CORP
International Classes:
G01N23/225; H01L21/02; H01L21/66; (IPC1-7): G01N23/225; H01L21/02; H01L21/66
Attorney, Agent or Firm:
Masuo Oiwa