Title:
ICモジュール付きの配送伝票および該配送伝票を用いた配送方法
Document Type and Number:
Japanese Patent JP4017294
Kind Code:
B2
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Inventors:
Koji Ishikawa
Application Number:
JP21690199A
Publication Date:
December 05, 2007
Filing Date:
July 30, 1999
Export Citation:
Assignee:
Toppan Forms Co., Ltd.
International Classes:
B65G61/00; G06K19/00; B07C3/12; B42D11/00; B65G1/137; B65G47/48; H01Q1/38
Domestic Patent References:
| JP5170331A | ||||
| JP11078323A | ||||
| JP7256998A |
Attorney, Agent or Firm:
Takao Yamaguchi