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Title:
PREPREG AND MANUFACTURE OF COPPER PLATED LAMINATED SHEET FOR WHICH THAT PREPREG IS USED
Document Type and Number:
Japanese Patent JPH0811130
Kind Code:
A
Abstract:

PURPOSE: To contrive a reduction of hit marks in a copper plated laminated sheet, by a method wherein an inorganic solvent is applied to a cut part of a prepreg which is cut into a fixed size and the coated prepreg and a copper foil are laminated by piling upon each other.

CONSTITUTION: Long-sized glass cloth is inpregnated with a thermosetting epoxy resin varnish and taken as a long-sized glass cloth epoxy prepreg. After the prepreg 6 is cut off into a fixed size and methyl acetate is applied to a cut part 7 by a sponge in which the methyl acetate is made to soak. The prepregs 6 whose application is completed are piled upon each other. Then a coarsed copper foil 3 is put on one side of a stainless steel mirror plate 14, on which a superposed prepreg 2 is put, on which the copper foil 3 is put, to which pressure is applied and a copper plated laminated sheet is formed. Therefore, resin powder or glass powder to be generated through the cut part 7 are eliminated and the surface of the copper foil becomes free from generating hit marks.


Inventors:
YAMAKAWA MASAE
KOMORI TAMIKO
Application Number:
JP14583494A
Publication Date:
January 16, 1996
Filing Date:
June 28, 1994
Export Citation:
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Assignee:
HITACHI CHEMICAL CO LTD
International Classes:
B29B11/16; B29B15/10; B29C43/18; B32B15/08; C08J5/24; B29K105/08; B29K105/22; B29L31/34; H05K3/02; (IPC1-7): B29B11/16; B29B15/10; B29C43/18; B32B15/08; C08J5/24
Attorney, Agent or Firm:
Kunihiko Wakabayashi